Description
TECHNICAL PROGRAM MANAGER
Qualified candidates will manage the preliminary and post sales technical requirements of
new and existing customers on semiconductor wafer sort and final test projects. The management
of these projects will include but are not limited to the presentation of STATSChipPACs
solutions based capability in the target markets for STATSChipPAC.
Candidates must be proficient in the technical characteristics of test platform
configuration, handler and prober capability, socket, loadboard and probecard
architecture, docking and interface solutions, data collecting and production procedures.
Responsible for providing direction, management and int/ext communication for new
semiconductor devices, package applications and technical manufacturing with end
customers resulting in new design wins, successful qualifications and revenue growth.
In addition, they are responsible for customer corrective action review, resolution
of quality/technical problems and are considered as a factory interface on new products.
Required to manage and multi-task on various programs, initiate cross functional
communication internally and with the customer and track products from end of wafer fab
through initial production.
Years of Experience:
5
Minimum five (5) years experience in Semiconductor assembly engineering,
plastic package design/engineering, new product/package product management and
quality engineering.
Required Education:
BSME/BSEE/BSMS or equivalent required
Apply Here
Salary: 75000 - 85000

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